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不同膠層厚度單搭接接頭剪切試驗與強度預測
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Strength of Adhesively Bonded Single Lap for Differential Bondline Thickness and Tension Loading Prediction
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    摘要:

    對不同膠層厚度的單搭接膠接接頭進行拉伸載荷的剪切試驗,對比膠層厚度以及膠瘤等因素對搭接接頭強度的影響,通過有限元數(shù)值仿真,模擬不同膠層厚度試驗件在接頭破壞位置附近的等效應力情況,得出隨膠層厚度的增加接頭強度逐漸減小、端部膠瘤降低了粘接表面應力峰值從而提高接頭強度等結(jié)論。同時引用HartSmith彎矩系數(shù)計算出較厚膠層單搭接接頭強度的保守值。

    Abstract:

    Adhesively bonded lap is used extensively in the manufacture of automotive structures. In order to explore the strength of the structures with lap joints, the adhesively bonded single lap joints with differential bondline thickness were tested in tension loading which creates shear across the bondline. Various parameters were investigated such as the bondline thickness and spew fillet. The equivalent stress was obtained through finite element analysis to define the effect of spew fillet for thick bondline, which helped to get the conclusions that strength of single lap was decreasing as bondline thickness increasing and spew fillet could reduce the peak value of stress so as to enhance the strength of lap joints. HartSmith factor was used to compute the tension load of single lap joints, which helped to get conservative prediction of strength.

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李 龍,胡 平,劉立忠.不同膠層厚度單搭接接頭剪切試驗與強度預測[J].農(nóng)業(yè)機械學報,2010,41(12):17-21. Li Long, Hu Ping, Liu Lizhong. Strength of Adhesively Bonded Single Lap for Differential Bondline Thickness and Tension Loading Prediction[J]. Transactions of the Chinese Society for Agricultural Machinery,2010,41(12):17-21.

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